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Symposium Proceedings
Vol. 2016, Issue S2, 2016
October 01, 2016 EDT
Experimental Study on 28nm Chip/Package Interactions in eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages
Dongkai Shangguan
,
Yao Jian Lin
,
Won Kyung Choi
,
Seng Guan Chow
,
Seung Wook Yoon
,
FOWLP
eWLB
Fan-out
•
https://doi.org/10.4071/isom-2016-slide-9
IMAPSource Conference Papers
Shangguan, Dongkai, Yao Jian Lin, Won Kyung Choi, Seng Guan Chow, and Seung Wook Yoon. 2016. “Experimental Study on 28nm Chip/Package Interactions in eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages.”
IMAPSource Proceedings
2016 (S2): S1–22.
https://doi.org/10.4071/isom-2016-slide-9
.
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