Vol. 2016, Issue S2, 2016October 01, 2016 EDT
Experimental Study on 28nm Chip/Package Interactions in eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages
Experimental Study on 28nm Chip/Package Interactions in eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages
Shangguan, Dongkai, Yao Jian Lin, Won Kyung Choi, Seng Guan Chow, and Seung Wook Yoon. 2016. “Experimental Study on 28nm Chip/Package Interactions in eWLB (Embedded Wafer Level BGA) Fan-Out Wafer Level Packages.” IMAPSource Proceedings 2016 (S2): S1–22. https://doi.org/10.4071/isom-2016-slide-9.
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