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Symposium Proceedings
Vol. 2016, Issue 1, 2016October 01, 2016 EDT

Additive Printing of Tight Tolerance Embedded Components via High Precision Shadow Masking and Their Integration with Traditional Circuit Board Manufacturing

V.D. Heydemann, S. Lauer, W. Decker, J. Slater, J. Mazurowski,
Additive Manufacturing of ElectronicsThin Film ElectronicsEmbedded Passive and Active Devices IntegrationPrecision Shadow MaskMask AlignmentLow Pressure Sputter Source and DepositionPhysical Vapor Deposition
https://doi.org/10.4071/isom-2016-WP14
IMAPSource Conference Papers
Heydemann, V.D., S. Lauer, W. Decker, J. Slater, and J. Mazurowski. 2016. “Additive Printing of Tight Tolerance Embedded Components via High Precision Shadow Masking and Their Integration with Traditional Circuit Board Manufacturing.” IMAPSource Proceedings 2016 (1): 267–71. https:/​/​doi.org/​10.4071/​isom-2016-WP14.
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