Improved Design of a High Density 3D Multichip Module for Class I Medical Devices

Doug Link; Michael Kollar

doi:10.4071/isom-2010-TA4-Paper3

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Link, Doug, and Michael Kollar. 2010. “Improved Design of a High Density 3D Multichip Module for Class I Medical Devices.” IMAPSource Proceedings 2010 (1): 119–26. https://doi.org/10.4071/isom-2010-TA4-Paper3.

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