Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Improved Design of a High Density 3D Multichip Module for Class I Medical Devices
Improved Design of a High Density 3D Multichip Module for Class I Medical Devices
Link, Doug, and Michael Kollar. 2010. “Improved Design of a High Density 3D Multichip Module for Class I Medical Devices.” IMAPSource Proceedings 2010 (1): 119–26. https://doi.org/10.4071/isom-2010-TA4-Paper3.