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Symposium Proceedings
Vol. 2018, Issue 1, 2018
October 01, 2018 EDT
Microstructure and Mechanical Properties of Pressureless Sintered Silver Die-attach Materials
Tomofumi Watanabe
,
Keisuke Tanaka
,
Masafumi Takesue
,
Copper bonding material
die-attach material
physical/mechanical properties
pressureless sintered silver
•
https://doi.org/10.4071/2380-4505-2018.1.000602
IMAPSource Conference Papers
Watanabe, Tomofumi, Keisuke Tanaka, and Masafumi Takesue. 2018. “Microstructure and Mechanical Properties of Pressureless Sintered Silver Die-Attach Materials.”
IMAPSource Proceedings
2018 (1): 602–5.
https://doi.org/10.4071/2380-4505-2018.1.000602
.
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