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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Microstructure and Mechanical Properties of Pressureless Sintered Silver Die-attach Materials

Tomofumi Watanabe, Keisuke Tanaka, Masafumi Takesue,
Copper bonding material die-attach material physical/mechanical properties pressureless sintered silver
• https://doi.org/10.4071/2380-4505-2018.1.000602
IMAPSource Conference Papers
Watanabe, Tomofumi, Keisuke Tanaka, and Masafumi Takesue. 2018. “Microstructure and Mechanical Properties of Pressureless Sintered Silver Die-Attach Materials.” IMAPSource Proceedings 2018 (1): 602–5. https://doi.org/10.4071/2380-4505-2018.1.000602.
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