Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects

Lee, Tae-Kyu, Weidong Xie, Thomas R. Bieler, Kuo-Chuan Liu, and Jie Xue. 2010. “Impact of Isothermal Aging on Fine Pitch BGA Packages with Sn-Ag-Cu Solder Interconnects.” IMAPSource Proceedings 2010 (1): 298–305. https:/​/​doi.org/​10.4071/​isom-2010-TP4-Paper3.