Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications
Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications
Saums, Dave, Tim Jensen, Carol Gowans, Seth Homer, and Ron Hunadi. 2019. “Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications.” IMAPSource Proceedings 2019 (1): 584–90. https://doi.org/10.4071/2380-4505-2019.1.000584.
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