Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Manual Assembly of 400um Bumped-Die GaN Power Semiconductor Devices
Manual Assembly of 400um Bumped-Die GaN Power Semiconductor Devices
Henning, Stephan W., Luke Jenkins, Sidni Hale, Christopher G. Wilson, John Tennant, Justin Moses, Mike Palmer, and Robert N. Dean. 2012. “Manual Assembly of 400um Bumped-Die GaN Power Semiconductor Devices.” IMAPSource Proceedings 2012 (1): 514–23. https://doi.org/10.4071/isom-2012-Poster_Hale.