MOCVD Copper Metallization for High Aspect Ratios TSV 3D Integration.

Sabrina Fadloun; Dean Stephens; Patrice Gergaud; Elisabeth Blanquet; Thierry Mourier; Chris Jones; Steve Burgess; Amit Rastogi

doi:10.4071/2380-4505-2018.1.000718

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Fadloun, Sabrina, Dean Stephens, Patrice Gergaud, Elisabeth Blanquet, Thierry Mourier, Chris Jones, Steve Burgess, and Amit Rastogi. 2018. “MOCVD Copper Metallization for High Aspect Ratios TSV 3D Integration.” IMAPSource Proceedings 2018 (1): 718–27. https://doi.org/10.4071/2380-4505-2018.1.000718.

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