Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Assembly and Scaling Challenges for 2.5D IC
Assembly and Scaling Challenges for 2.5D IC
Wang, Liang, Charles G. Woychik, Guilian Gao, Scott McGrath, Hong Shen, Eric Tosaya, and Sitaram Arkalgud. 2014. “Assembly and Scaling Challenges for 2.5D IC.” IMAPSource Proceedings 2014 (1): 606–11. https://doi.org/10.4071/isom-WP12.