Assembly and Scaling Challenges for 2.5D IC

Liang Wang; Charles G. Woychik; Guilian Gao; Scott McGrath; Hong Shen; Eric Tosaya; Sitaram Arkalgud

doi:10.4071/isom-WP12

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Wang, Liang, Charles G. Woychik, Guilian Gao, Scott McGrath, Hong Shen, Eric Tosaya, and Sitaram Arkalgud. 2014. “Assembly and Scaling Challenges for 2.5D IC.” IMAPSource Proceedings 2014 (1): 606–11. https://doi.org/10.4071/isom-WP12.

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