Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Custom Thickness Bare Die Availability of Any Product Through Device Extraction, Thinning, and UBM Pad Re-Conditioning
Custom Thickness Bare Die Availability of Any Product Through Device Extraction, Thinning, and UBM Pad Re-Conditioning
Spory, Erick M. 2014. “Custom Thickness Bare Die Availability of Any Product Through Device Extraction, Thinning, and UBM Pad Re-Conditioning.” IMAPSource Proceedings 2014 (1): 585–88. https://doi.org/10.4071/isom-Poster7.