Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Electrical Demonstration of TSV Interconnects and Multilevel Metallization for 3D Si Interposer Applications
Electrical Demonstration of TSV Interconnects and Multilevel Metallization for 3D Si Interposer Applications
Vick, Erik, Scott Goodwin, and Dorota Temple. 2010. “Electrical Demonstration of TSV Interconnects and Multilevel Metallization for 3D Si Interposer Applications.” IMAPSource Proceedings 2010 (1): 7–14. https://doi.org/10.4071/isom-2010-TA1-Paper2.