The Microelectronic Wire Bond: Past, Present, and Future | Published in IMAPSource Proceedings

IMAPSource Conference Papers

Charles, Harry K. 2010. “The Microelectronic Wire Bond: Past, Present, and Future.” IMAPSource Proceedings 2010 (1): 462–69. https://doi.org/10.4071/isom-2010-WA4-Paper1.

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