High Melting Temperature Lead Free Solder for Die Attach Application

Jianxing Li; Daniel Lau; Pingliang Tu; Andrew Delano; Brian Knight

doi:10.4071/isom-2011-TP4-Paper1

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Li, Jianxing, Daniel Lau, Pingliang Tu, Andrew Delano, and Brian Knight. 2011. “High Melting Temperature Lead Free Solder for Die Attach Application.” IMAPSource Proceedings 2011 (1): 322–26. https://doi.org/10.4071/isom-2011-TP4-Paper1.

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