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ISSN 2380-4505
Symposium Proceedings
Vol. 2011, Issue 1, 2011January 01, 2011 EDT

Build-up Electrical Insulation Material with Low-Dielectric Loss Tangent, Low-CTE and Low-Surface Roughness

Eita HORIKI, Isao SUZUKI, Toshiaki TANAKA, Akihiro UENISHI, Hiroshi KOUYANAGI,
Build-up Electrical Insulation MaterialLow-Dielectric Loss TangentLow-CTELow-Surface RoughnessLSIs
https://doi.org/10.4071/isom-2011-WP5-Paper2
IMAPSource Conference Papers
HORIKI, Eita, Isao SUZUKI, Toshiaki TANAKA, Akihiro UENISHI, and Hiroshi KOUYANAGI. 2011. “Build-up Electrical Insulation Material with Low-Dielectric Loss Tangent, Low-CTE and Low-Surface Roughness.” IMAPSource Proceedings 2011 (1): 813–19. https:/​/​doi.org/​10.4071/​isom-2011-WP5-Paper2.

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