Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Characterization of Interconnects and RF Components on Glass Interposers
Characterization of Interconnects and RF Components on Glass Interposers
Ivan Ndip, Michael Töpper, Kai Löbbicke, Abdurrahman Öz, Stephan Guttowski, Herbert Reichl, Klaus-Dieter Lang,
Ndip, Ivan, Michael Töpper, Kai Löbbicke, Abdurrahman Öz, Stephan Guttowski, Herbert Reichl, and Klaus-Dieter Lang. 2012. “Characterization of Interconnects and RF Components on Glass Interposers.” IMAPSource Proceedings 2012 (1): 770–80. https://doi.org/10.4071/isom-2012-WP13.