Characterization of Interconnects and RF Components on Glass Interposers

Ivan Ndip; Michael Töpper; Kai Löbbicke; Abdurrahman Öz; Stephan Guttowski; Herbert Reichl; Klaus-Dieter Lang

doi:10.4071/isom-2012-WP13

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Ndip, Ivan, Michael Töpper, Kai Löbbicke, Abdurrahman Öz, Stephan Guttowski, Herbert Reichl, and Klaus-Dieter Lang. 2012. “Characterization of Interconnects and RF Components on Glass Interposers.” IMAPSource Proceedings 2012 (1): 770–80. https://doi.org/10.4071/isom-2012-WP13.

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