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Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Control of Void Formation in Adhesively Bonded Joints in the Presence of Filler

Nina S. Dytiuk, Thomas F. Marinis, Joseph W. Soucy,
Void adhesive joint die bond epoxy film diffusion filler
• https://doi.org/10.4071/2380-4505-2020.1.000246
IMAPSource Conference Papers
Dytiuk, Nina S., Thomas F. Marinis, and Joseph W. Soucy. 2020. “Control of Void Formation in Adhesively Bonded Joints in the Presence of Filler.” IMAPSource Proceedings 2020 (1): 246–58. https://doi.org/10.4071/2380-4505-2020.1.000246.
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