BGA Solder Life Prediction under Combined Power and Temperature Cycling Condition

Fei Chai; Michael Osterman; Michael Pecht

doi:10.4071/isom-2012-Poster_Chai

Chai, Fei, Michael Osterman, and Michael Pecht. 2012. “BGA Solder Life Prediction under Combined Power and Temperature Cycling Condition.” IMAPSource Proceedings 2012 (1): 531–34. https://doi.org/10.4071/isom-2012-Poster_Chai.

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