BGA Solder Life Prediction under Combined Power and Temperature Cycling Condition

Fei Chai; Michael Osterman; Michael Pecht

doi:10.4071/isom-2012-Poster_Chai

Chai, Fei, Michael Osterman, and Michael Pecht. 2012. “BGA Solder Life Prediction under Combined Power and Temperature Cycling Condition.” IMAPSource Proceedings 2012 (1): 531–34. https://doi.org/10.4071/isom-2012-Poster_Chai.

View more stats

BGA Solder Life Prediction under Combined Power and Temperature Cycling Condition

This website uses cookies