Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Solder Joint Reliability Modeling of WLP and FOWLP with Crack Path Evaluation Method under Thermal Cycling
Solder Joint Reliability Modeling of WLP and FOWLP with Crack Path Evaluation Method under Thermal Cycling
Kim, Dae-Suk, and Karthikeyan Dhandapani. 2020. “Solder Joint Reliability Modeling of WLP and FOWLP with Crack Path Evaluation Method under Thermal Cycling.” IMAPSource Proceedings 2020 (1): 1–4. https://doi.org/10.4071/2380-4505-2020.1.000001.