Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Evaluation of Low Cost, High Temperature Die and Substrate Attach Materials for Silicon Carbide (SiC) Power Modules
Evaluation of Low Cost, High Temperature Die and Substrate Attach Materials for Silicon Carbide (SiC) Power Modules
Seal, Sayan, Brandon Passmore, and Brice McPherson. 2018. “Evaluation of Low Cost, High Temperature Die and Substrate Attach Materials for Silicon Carbide (SiC) Power Modules.” IMAPSource Proceedings 2018 (1): 317–25. https://doi.org/10.4071/2380-4505-2018.1.000317.
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