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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Aluminum bond pad corrosion of wirebond packages
Varughese Mathew
,
Sheila Chopin
,
Oliver Chyan
,
Nick Ross
,
Alex Lambert
,
Muthappan Asokan
,
Al Pad corrosion
Microelectronic Corrosion
Mold Compounds
Mud-Crack
Electronic Packages
Wirebond
•
https://doi.org/10.4071/isom-2016-WA53
IMAPSource Conference Papers
Mathew, Varughese, Sheila Chopin, Oliver Chyan, Nick Ross, Alex Lambert, and Muthappan Asokan. 2016. “Aluminum Bond Pad Corrosion of Wirebond Packages.”
IMAPSource Proceedings
2016 (1): 227–33.
https://doi.org/10.4071/isom-2016-WA53
.
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