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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

High-brightness LEDs of big chip size on multi-layer interconnects with optimized thermal dissipation and optical performance

Liang Wang, Gabe Guevara, Grant Villavicencio, Roseann Alatorre, Hala Shaba, Rey Co, Eric Tosaya,
LED lightingbig chipflip-chip assemblymulti-layer interconnectlight extractiondielectric mirror
https://doi.org/10.4071/isom-THP46
IMAPSource Conference Papers
Wang, Liang, Gabe Guevara, Grant Villavicencio, Roseann Alatorre, Hala Shaba, Rey Co, and Eric Tosaya. 2014. “High-Brightness LEDs of Big Chip Size on Multi-Layer Interconnects with Optimized Thermal Dissipation and Optical Performance.” IMAPSource Proceedings 2014 (1): 877–81. https:/​/​doi.org/​10.4071/​isom-THP46.
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