Vol. 2015, Issue 1, 2015October 01, 2015 EDT
High Thermal Stability of SiC Packaging with Sintered Ag Paste Die-attach combined with Imide-based Molding
High Thermal Stability of SiC Packaging with Sintered Ag Paste Die-attach combined with Imide-based Molding
Nagao, Shijo, Takuo Sugioka, Satoshi Ogawa, Teruhisa Fujibayashi, Zhang Hao, and Katsuaki Suganuma. 2015. “High Thermal Stability of SiC Packaging with Sintered Ag Paste Die-Attach Combined with Imide-Based Molding.” IMAPSource Proceedings 2015 (1): 349–52. https://doi.org/10.4071/isom-2015-WP15.