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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Large Laminate and Die Coreless Substrate Packaging with Lid Ties

Edmund Blackshear, Brian W Quinlan, Benjamin Fasano, David J Lewison, Shidong Li, Hugues C Gagnon, Paul Fortier, Richard Heath, Frederick Roy, Elaine Cyr Takashi Nakajima, Yoichi Miyazawa, Itsuroh Shishido, Tomoyuki Yamada,
Corelessflip chiplaminatesubstratelid ties
https://doi.org/10.4071/isom-TA32
IMAPSource Conference Papers
Blackshear, Edmund, Brian W Quinlan, Benjamin Fasano, David J Lewison, Shidong Li, Hugues C Gagnon, Paul Fortier, et al. 2014. “Large Laminate and Die Coreless Substrate Packaging with Lid Ties.” IMAPSource Proceedings 2014 (1): 74–80. https:/​/​doi.org/​10.4071/​isom-TA32.
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