Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Large Laminate and Die Coreless Substrate Packaging with Lid Ties
Large Laminate and Die Coreless Substrate Packaging with Lid Ties
Blackshear, Edmund, Brian W Quinlan, Benjamin Fasano, David J Lewison, Shidong Li, Hugues C Gagnon, Paul Fortier, et al. 2014. “Large Laminate and Die Coreless Substrate Packaging with Lid Ties.” IMAPSource Proceedings 2014 (1): 74–80. https://doi.org/10.4071/isom-TA32.