Large Laminate and Die Coreless Substrate Packaging with Lid Ties

Edmund Blackshear; Brian W Quinlan; Benjamin Fasano; David J Lewison; Shidong Li; Hugues C Gagnon; Paul Fortier; Richard Heath; Frederick Roy; Elaine Cyr Takashi Nakajima; Yoichi Miyazawa; Itsuroh Shishido; Tomoyuki Yamada

doi:10.4071/isom-TA32

Blackshear, Edmund, Brian W Quinlan, Benjamin Fasano, David J Lewison, Shidong Li, Hugues C Gagnon, Paul Fortier, et al. 2014. “Large Laminate and Die Coreless Substrate Packaging with Lid Ties.” IMAPSource Proceedings 2014 (1): 74–80. https://doi.org/10.4071/isom-TA32.

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