Vol. 2013, Issue 1, 2013January 01, 2013 EDT
2.5 / 3D PACKAGING TECHNOLOGY SOLUTION FOR HIGH FREQUENCY DEVICE.
2.5 / 3D PACKAGING TECHNOLOGY SOLUTION FOR HIGH FREQUENCY DEVICE.
Morikawa, Yasuhiro, Takahide Murayama, Toshiyuki Sakuishi, and Koukou Suu. 2013. “2.5 / 3D PACKAGING TECHNOLOGY SOLUTION FOR HIGH FREQUENCY DEVICE.” IMAPSource Proceedings 2013 (1): 13–16. https://doi.org/10.4071/isom-2013-TA14.