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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
Effects of Probe Marks on Shear Test of Copper Ball Bonds in Two Pad Aluminum Thicknesses
Priscila Brown
,
Rachel Wynder
,
Dustin Tenney
,
Stevan Hunter
,
Copper wirebond
bond pad
wafer probe marks
wirebond reliability
bond shear test
•
https://doi.org/10.4071/isom-2016-WA52
IMAPSource Conference Papers
Brown, Priscila, Rachel Wynder, Dustin Tenney, and Stevan Hunter. 2016. “Effects of Probe Marks on Shear Test of Copper Ball Bonds in Two Pad Aluminum Thicknesses.”
IMAPSource Proceedings
2016 (1): 219–26.
https://doi.org/10.4071/isom-2016-WA52
.
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