Vol. 2016, Issue 1, 2016October 01, 2016 EDT
3D TSV-based Inductor Design for a Secure Internet of Things
3D TSV-based Inductor Design for a Secure Internet of Things
Kim, Bruce, and Sang-Bock Cho. 2016. “3D TSV-Based Inductor Design for a Secure Internet of Things.” IMAPSource Proceedings 2016 (1): 364–67. https://doi.org/10.4071/isom-2016-WP53.
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