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Symposium Proceedings
Vol. 2016, Issue 1, 2016
October 01, 2016 EDT
3D TSV-based Inductor Design for a Secure Internet of Things
Bruce Kim
,
Sang-Bock Cho
,
3D Inductor
IoT
TSV
RO PUF
•
https://doi.org/10.4071/isom-2016-WP53
IMAPSource Conference Papers
Kim, Bruce, and Sang-Bock Cho. 2016. “3D TSV-Based Inductor Design for a Secure Internet of Things.”
IMAPSource Proceedings
2016 (1): 364–67.
https://doi.org/10.4071/isom-2016-WP53
.
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