Vol. 2011, Issue 1, 2011January 01, 2011 EDT
A Path Toward Non-Destructive 3D Metrology for Through-Silicon Vias
A Path Toward Non-Destructive 3D Metrology for Through-Silicon Vias
Gelb, Jeff, LayWai Kong, Luke Hunter, Allen Gu, Tiffany Fong, Alain C. Diebold, S. H. Lau, and Wenbing Yun. 2011. “A Path Toward Non-Destructive 3D Metrology for Through-Silicon Vias.” IMAPSource Proceedings 2011 (1): 17–24. https://doi.org/10.4071/isom-2011-TA1-Paper3.