Vol. 2010, Issue 1, 2010January 01, 2010 EDT
On the Origins, Status, and Future of Flip Chip & Wafer Level Packaging
On the Origins, Status, and Future of Flip Chip & Wafer Level Packaging
Huffman, Alan, and Philip Garrou. 2010. “On the Origins, Status, and Future of Flip Chip & Wafer Level Packaging.” IMAPSource Proceedings 2010 (1): 325–32. https://doi.org/10.4071/isom-2010-TP5-Paper1.
Powered by Scholastica, the modern academic journal management system