Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Design of BGA Assemblies with Enhanced Thermal Cycle Capability Using Solder Coated Polymer Balls
Design of BGA Assemblies with Enhanced Thermal Cycle Capability Using Solder Coated Polymer Balls
Marinis, Thomas F., and Joseph W. Soucy. 2016. “Design of BGA Assemblies with Enhanced Thermal Cycle Capability Using Solder Coated Polymer Balls.” IMAPSource Proceedings 2016 (1): 123–33. https://doi.org/10.4071/isom-2016-TP55.