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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
Design and Direct Assembly of 2.5D/3D Rigid Silicon Interposer on PCB
Farhang Yazdani
,
2.5D/3D
Assembly
Cost
Design
Flip Chip
Integration
Package
Reliability
Silicon Interposer
Substrate
Thermal Stress
TSV
Warpage
Yield
•
https://doi.org/10.4071/isom-THP12
IMAPSource Conference Papers
Yazdani, Farhang. 2014. “Design and Direct Assembly of 2.5D/3D Rigid Silicon Interposer on PCB.”
IMAPSource Proceedings
2014 (1): 783–86.
https://doi.org/10.4071/isom-THP12
.
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