Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Barrier Properties of Electroless Ni-B UBM for Solder Joining
Barrier Properties of Electroless Ni-B UBM for Solder Joining
Morita, Masaru, Toshiya Akamatsu, Nobuhiro Imaizumi, and Seiki Sakuyama. 2015. “Barrier Properties of Electroless Ni-B UBM for Solder Joining.” IMAPSource Proceedings 2015 (1): 862–67. https://doi.org/10.4071/isom-2015-THP45.