Barrier Properties of Electroless Ni-B UBM for Solder Joining

Masaru Morita; Toshiya Akamatsu; Nobuhiro Imaizumi; Seiki Sakuyama

doi:10.4071/isom-2015-THP45

Morita, Masaru, Toshiya Akamatsu, Nobuhiro Imaizumi, and Seiki Sakuyama. 2015. “Barrier Properties of Electroless Ni-B UBM for Solder Joining.” IMAPSource Proceedings 2015 (1): 862–67. https://doi.org/10.4071/isom-2015-THP45.

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Barrier Properties of Electroless Ni-B UBM for Solder Joining

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