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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
High Temperature Packaging for SiC Power Transistors
K. Brinkfeldt
,
T. Åklint
,
C. Sandberg
,
P. Johander
,
D. Andersson
,
SiC
packaging
BJT
MOSFET
high temperature
•
https://doi.org/10.4071/isom-2012-THP36
IMAPSource Conference Papers
Brinkfeldt, K., T. Åklint, C. Sandberg, P. Johander, and D. Andersson. 2012. “High Temperature Packaging for SiC Power Transistors.”
IMAPSource Proceedings
2012 (1): 1124–30.
https://doi.org/10.4071/isom-2012-THP36
.
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