ISSN 2380-4505
Brinkfeldt, K., T. Åklint, C. Sandberg, P. Johander, and D. Andersson. 2012. “High Temperature Packaging for SiC Power Transistors.” IMAPSource Proceedings 2012 (1): 1124–30. https://doi.org/10.4071/isom-2012-THP36.
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