Vol. 2014, Issue 1, 2014January 01, 2014 EDT
A Resealable Hermetic Packaging Technique for Silicon Microfluidic Devices
A Resealable Hermetic Packaging Technique for Silicon Microfluidic Devices
Smith, Lilla Safford, Gordon D. Hoople, Jim C. Cheng, and Albert P. Pisano. 2014. “A Resealable Hermetic Packaging Technique for Silicon Microfluidic Devices.” IMAPSource Proceedings 2014 (1): 516–21. https://doi.org/10.4071/isom-WA53.