Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level Packaging

Yuji Okada; Atsushi Fujii; Kenta Ono; Yoshiharu Kariya

doi:10.4071/2380-4505-2020.1.000094

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Okada, Yuji, Atsushi Fujii, Kenta Ono, and Yoshiharu Kariya. 2020. “Reliability Simulation of Cu/Polymer Interface in Fan-out Wafer Level Packaging.” IMAPSource Proceedings 2020 (1): 94–99. https://doi.org/10.4071/2380-4505-2020.1.000094.

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