Vol. 2020, Issue 1, 2020September 01, 2020 EDT
Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level Packaging
Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level Packaging
Okada, Yuji, Atsushi Fujii, Kenta Ono, and Yoshiharu Kariya. 2020. “Reliability Simulation of Cu/Polymer Interface in Fan-out Wafer Level Packaging.” IMAPSource Proceedings 2020 (1): 94–99. https://doi.org/10.4071/2380-4505-2020.1.000094.