Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:54963/feed
Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Reliability Simulation of Cu/Polymer interface in Fan-out Wafer Level Packaging

Yuji Okada, Atsushi Fujii, Kenta Ono, Yoshiharu Kariya,
Finite Element Analysis (FEA)SimulationReliabilityDelaminationFan-out Wafer Level Packaging (FOWLP)Polymer
https://doi.org/10.4071/2380-4505-2020.1.000094
IMAPSource Conference Papers
Okada, Yuji, Atsushi Fujii, Kenta Ono, and Yoshiharu Kariya. 2020. “Reliability Simulation of Cu/Polymer Interface in Fan-out Wafer Level Packaging.” IMAPSource Proceedings 2020 (1): 94–99. https:/​/​doi.org/​10.4071/​2380-4505-2020.1.000094.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system