Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers
Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers
Choi, Kwang-Seong, Ho-Eun Bae, Haksun Lee, Hyun-Cheol Bae, and Yong-Sung Eom. 2013. “Thermally Activated Bumping Process Using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers.” IMAPSource Proceedings 2013 (1): 420–23. https://doi.org/10.4071/isom-2013-TP66.