Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers
Kwang-Seong Choi
,
Ho-Eun Bae
,
Haksun Lee
,
Hyun-Cheol Bae
,
Yong-Sung Eom
,
Solder bump maker (SBM)
maskless screen printing process
fine-pitch flip chip
solder-on-pad (SoP)
thermally activated aggregation
lead-free solder powder
•
https://doi.org/10.4071/isom-2013-TP66
IMAPSource Conference Papers
Choi, Kwang-Seong, Ho-Eun Bae, Haksun Lee, Hyun-Cheol Bae, and Yong-Sung Eom. 2013. “Thermally Activated Bumping Process Using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers.”
IMAPSource Proceedings
2013 (1): 420–23.
https://doi.org/10.4071/isom-2013-TP66
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats