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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers

Kwang-Seong Choi, Ho-Eun Bae, Haksun Lee, Hyun-Cheol Bae, Yong-Sung Eom,
Solder bump maker (SBM)maskless screen printing processfine-pitch flip chipsolder-on-pad (SoP)thermally activated aggregationlead-free solder powder
https://doi.org/10.4071/isom-2013-TP66
IMAPSource Conference Papers
Choi, Kwang-Seong, Ho-Eun Bae, Haksun Lee, Hyun-Cheol Bae, and Yong-Sung Eom. 2013. “Thermally Activated Bumping Process Using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers.” IMAPSource Proceedings 2013 (1): 420–23. https:/​/​doi.org/​10.4071/​isom-2013-TP66.
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