Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers

Kwang-Seong Choi; Ho-Eun Bae; Haksun Lee; Hyun-Cheol Bae; Yong-Sung Eom

doi:10.4071/isom-2013-TP66

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Choi, Kwang-Seong, Ho-Eun Bae, Haksun Lee, Hyun-Cheol Bae, and Yong-Sung Eom. 2013. “Thermally Activated Bumping Process Using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers.” IMAPSource Proceedings 2013 (1): 420–23. https://doi.org/10.4071/isom-2013-TP66.

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