ISSN 2380-4505
Vol. 2015, Issue S1, 2015October 01, 2015 EDT
Future Challenges and Roadmaps of Semiconductor, Packaging and Integration
Future Challenges and Roadmaps of Semiconductor, Packaging and Integration
Hellenthal, Berthold. 2015. “Future Challenges and Roadmaps of Semiconductor, Packaging and Integration.” IMAPSource Proceedings 2015 (S1): S1–37. https://doi.org/10.4071/isom-2015-slide-2.