ISSN 2380-4505
Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Wire Bonding Advances for Multi-Chip and System in Package Devices
Wire Bonding Advances for Multi-Chip and System in Package Devices
Xu, Hui, Aashish Shah, Basil Milton, and Ivy Qin. 2018. “Wire Bonding Advances for Multi-Chip and System in Package Devices.” IMAPSource Proceedings 2018 (1): 583–88. https://doi.org/10.4071/2380-4505-2018.1.000583.