Vol. 2016, Issue 1, 2016October 01, 2016 EDT
Challenges in Fine Feature Solder Paste Printing for SiP Applications
Challenges in Fine Feature Solder Paste Printing for SiP Applications
Pei-Lim, Sze, Kenneth Thum, and Andy Mackie. 2016. “Challenges in Fine Feature Solder Paste Printing for SiP Applications.” IMAPSource Proceedings 2016 (1): 245–49. https://doi.org/10.4071/isom-2016-WP12.