Challenges in Fine Feature Solder Paste Printing for SiP Applications

Sze Pei-Lim; Kenneth Thum; Andy Mackie

doi:10.4071/isom-2016-WP12

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Pei-Lim, Sze, Kenneth Thum, and Andy Mackie. 2016. “Challenges in Fine Feature Solder Paste Printing for SiP Applications.” IMAPSource Proceedings 2016 (1): 245–49. https://doi.org/10.4071/isom-2016-WP12.

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