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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

Advances in Wafer Level Processing and Integration for CIS Module Manufacturing

Bioh Kim, Thorsten Matthias, Gerald Kreindl, Viorel Dragoi, Markus Wimplinger, Paul Lindner,
CIS module BSI wafer-level camera wafer-level optics wafer-level processing and integration
• https://doi.org/10.4071/isom-2010-WA1-Paper5
IMAPSource Conference Papers
Kim, Bioh, Thorsten Matthias, Gerald Kreindl, Viorel Dragoi, Markus Wimplinger, and Paul Lindner. 2010. “Advances in Wafer Level Processing and Integration for CIS Module Manufacturing.” IMAPSource Proceedings 2010 (1): 378–84. https://doi.org/10.4071/isom-2010-WA1-Paper5.
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