Kim, Bioh, Thorsten Matthias, Gerald Kreindl, Viorel Dragoi, Markus Wimplinger, and Paul Lindner. 2010. “Advances in Wafer Level Processing and Integration for CIS Module Manufacturing.” IMAPSource Proceedings 2010 (1): 378–84. https://doi.org/10.4071/isom-2010-WA1-Paper5.