ISSN 2380-4505
Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology
Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology
Tamil, Jonathan, Siew Hoon Ore, Kian Yeow Gan, Yang Yong Bo, Geraldine Ng, Park Teck Wah, Nathapong Suthiwongsunthorn, and Surasit Chungpaiboonpatana. 2011. “Molding Flow Modeling and Experimental Study on Void Control for Flip Chip Package Panel Molding with Molded Underfill Technology.” IMAPSource Proceedings 2011 (1): 673–82. https://doi.org/10.4071/isom-2011-WP1-Paper4.