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Symposium Proceedings
Vol. 2020, Issue 1, 2020September 01, 2020 EDT

Thermal improvement in 3D embedded modules using copper bar vias

Manoj Kakade, Richard Dowling, Mumtaz Bora, Jake Tubbs, Ahmed Maghawri,
# Embedded diePMICFan Out Wafer level ModuleThermal Improvement
https://doi.org/10.4071/2380-4505-2020.1.000005
IMAPSource Conference Papers
Kakade, Manoj, Richard Dowling, Mumtaz Bora, Jake Tubbs, and Ahmed Maghawri. 2020. “Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias.” IMAPSource Proceedings 2020 (1): 5–8. https:/​/​doi.org/​10.4071/​2380-4505-2020.1.000005.
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