Thermal improvement in 3D embedded modules using copper bar vias

Manoj Kakade; Richard Dowling; Mumtaz Bora; Jake Tubbs; Ahmed Maghawri

doi:10.4071/2380-4505-2020.1.000005

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Kakade, Manoj, Richard Dowling, Mumtaz Bora, Jake Tubbs, and Ahmed Maghawri. 2020. “Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias.” IMAPSource Proceedings 2020 (1): 5–8. https://doi.org/10.4071/2380-4505-2020.1.000005.

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