Thermal improvement in 3D embedded modules using copper bar vias

Kakade, Manoj, Richard Dowling, Mumtaz Bora, Jake Tubbs, and Ahmed Maghawri. 2020. “Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias.” IMAPSource Proceedings 2020 (1): 5–8. https:/​/​doi.org/​10.4071/​2380-4505-2020.1.000005.