Vol. 2011, Issue 1, 2011January 01, 2011 EDT
3D-stacking of UTCPs as a module miniaturization technology
3D-stacking of UTCPs as a module miniaturization technology
Priyabadini, S., A. Gielen, K. Dhaenens, W. Christiaens, S. Van Put, G. Kunkel, A.E. Petersen, and J. Vanfleteren. 2011. “3D-Stacking of UTCPs as a Module Miniaturization Technology.” IMAPSource Proceedings 2011 (1): 463–68. https://doi.org/10.4071/isom-2011-WA1-Paper3.