Loading [Contrib]/a11y/accessibility-menu.js
Skip to main content
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
EMPC Conference Proceedings (IMAPS Europe)
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2020, Issue 1, 2020
September 01, 2020 EDT
Wire Bonding: The Ultrasonic Bonding Mechanism
Lee Levine
,
Wire Bonding
Ultrasonic Bonding
welding
ball bonding
wedge bonding
•
https://doi.org/10.4071/2380-4505-2020.1.000230
IMAPSource Conference Papers
Levine, Lee. 2020. “Wire Bonding: The Ultrasonic Bonding Mechanism.”
IMAPSource Proceedings
2020 (1): 230–34.
https://doi.org/10.4071/2380-4505-2020.1.000230
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats
