Evaluating the Impact of Dwell Time on Solder Interconnect Durability under Bending Loads

Sandeep Menon; Michael Osterman; Michael Pecht

doi:10.4071/isom-2012-Poster_Menon

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Menon, Sandeep, Michael Osterman, and Michael Pecht. 2012. “Evaluating the Impact of Dwell Time on Solder Interconnect Durability under Bending Loads.” IMAPSource Proceedings 2012 (1): 510–13. https://doi.org/10.4071/isom-2012-Poster_Menon.

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