SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS

Mary Liu; Wusheng Yin

doi:10.4071/isom-TA63

Loading [Contrib]/a11y/accessibility-menu.js

Liu, Mary, and Wusheng Yin. 2014. “SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS.” IMAPSource Proceedings 2014 (1): 165–69. https://doi.org/10.4071/isom-TA63.

View more stats