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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS

Mary Liu, Wusheng Yin,
Solder anisotropic conductive adhesive 3D package
• https://doi.org/10.4071/isom-TA63
IMAPSource Conference Papers
Liu, Mary, and Wusheng Yin. 2014. “SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS.” IMAPSource Proceedings 2014 (1): 165–69. https://doi.org/10.4071/isom-TA63.
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