Vol. 2014, Issue 1, 2014January 01, 2014 EDT
SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS
SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS
Liu, Mary, and Wusheng Yin. 2014. “SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS.” IMAPSource Proceedings 2014 (1): 165–69. https://doi.org/10.4071/isom-TA63.