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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS
Mary Liu
,
Wusheng Yin
,
Solder anisotropic conductive adhesive
3D package
•
https://doi.org/10.4071/isom-TA63
IMAPSource Conference Papers
Liu, Mary, and Wusheng Yin. 2014. “SOLDERABLE ANISOTROPIC CONDUCTIVE ADHESIVES FOR 3D PACKAGE APPLICATIONS.”
IMAPSource Proceedings
2014 (1): 165–69.
https://doi.org/10.4071/isom-TA63
.
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