Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages
Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages
Sayeed, Sk Yeahia Been, Daniel Wilding, Jose Solis Camara, Dieff Vital, Shubhendu Bhardwaj, and P. M Raj. 2019. “Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages.” IMAPSource Proceedings 2019 (1): 163–68. https://doi.org/10.4071/2380-4505-2019.1.000163.