Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:22663/feed
Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages

Sk Yeahia Been Sayeed, Daniel Wilding, Jose Solis Camara, Dieff Vital, Shubhendu Bhardwaj, P. M Raj,
fan-outdie-embedddingdeformableflexibleinterconnectsremateablehigh-conductivity
https://doi.org/10.4071/2380-4505-2019.1.000163
IMAPSource Conference Papers
Sayeed, Sk Yeahia Been, Daniel Wilding, Jose Solis Camara, Dieff Vital, Shubhendu Bhardwaj, and P. M Raj. 2019. “Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages.” IMAPSource Proceedings 2019 (1): 163–68. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.000163.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system