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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Through Silicon Via (TSV) Technology Creates Electro-Optical Interfaces

Phil Marcoux,
FLIP-CHIP PASSIVE ALIGNMENTSILICON INTERPOSERWAFER-SCALE PROCESSINGVERTICAL CAVITY SURFACE EMITTING LASER ARRAY (VCSEL ARRAY)VCSEL DRIVER ARRAY ICINTERCONNECT BANDWIDTH DENSITYLASER FIBER ENDFACE CUTTINGTHROUGH SILICON VIASCHIP-TO-WORLD INTERCONNECTS
https://doi.org/10.4071/isom-2012-TP13
IMAPSource Conference Papers
Marcoux, Phil. 2012. “Through Silicon Via (TSV) Technology Creates Electro-Optical Interfaces.” IMAPSource Proceedings 2012 (1): 244–48. https:/​/​doi.org/​10.4071/​isom-2012-TP13.
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