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Symposium Proceedings
Vol. 2012, Issue 1, 2012
January 01, 2012 EDT
Through Silicon Via (TSV) Technology Creates Electro-Optical Interfaces
Phil Marcoux
,
FLIP-CHIP PASSIVE ALIGNMENT
SILICON INTERPOSER
WAFER-SCALE PROCESSING
VERTICAL CAVITY SURFACE EMITTING LASER ARRAY (VCSEL ARRAY)
VCSEL DRIVER ARRAY IC
INTERCONNECT BANDWIDTH DENSITY
LASER FIBER ENDFACE CUTTING
THROUGH SILICON VIAS
CHIP-TO-WORLD INTERCONNECTS
•
https://doi.org/10.4071/isom-2012-TP13
IMAPSource Conference Papers
Marcoux, Phil. 2012. “Through Silicon Via (TSV) Technology Creates Electro-Optical Interfaces.”
IMAPSource Proceedings
2012 (1): 244–48.
https://doi.org/10.4071/isom-2012-TP13
.
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