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Symposium Proceedings
Vol. 2010, Issue 1, 2010January 01, 2010 EDT

A New Coreless Substrate Technology

Bernd K. Appelt, Alex S.F. Huang, Bruce Su, Yi-Shao Lai,
coreless substrateorganice substrateswireabilityABFresindie attachtemporary carriervia interconnections
https://doi.org/10.4071/isom-2010-THA3-Paper3
IMAPSource Conference Papers
Appelt, Bernd K., Alex S.F. Huang, Bruce Su, and Yi-Shao Lai. 2010. “A New Coreless Substrate Technology.” IMAPSource Proceedings 2010 (1): 842–46. https:/​/​doi.org/​10.4071/​isom-2010-THA3-Paper3.
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