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Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
A New Coreless Substrate Technology
Bernd K. Appelt
,
Alex S.F. Huang
,
Bruce Su
,
Yi-Shao Lai
,
coreless substrate
organice substrates
wireability
ABF
resin
die attach
temporary carrier
via interconnections
•
https://doi.org/10.4071/isom-2010-THA3-Paper3
IMAPSource Conference Papers
Appelt, Bernd K., Alex S.F. Huang, Bruce Su, and Yi-Shao Lai. 2010. “A New Coreless Substrate Technology.”
IMAPSource Proceedings
2010 (1): 842–46.
https://doi.org/10.4071/isom-2010-THA3-Paper3
.
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