Chuang, Chuan Lung, Min-Fong Shu, and Yi-Hsiu Tseng. 2018. “The Effect of Nickel Oxidation Formed in the Interface of ENEPIG Structure for Flip Chip Technology.” IMAPSource Proceedings 2018 (1): 146–52. https://doi.org/10.4071/2380-4505-2018.1.000146.