Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost

Henning Hübner; Christian Ohde; Dirk Ruess

doi:10.4071/2380-4505-2018.1.000037

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Hübner, Henning, Christian Ohde, and Dirk Ruess. 2018. “Upscaling Panel Size for Cu Plating on FOPLP (Fan Out Panel Level Packaging) Applications to Reduce Manufacturing Cost.” IMAPSource Proceedings 2018 (1): 37–42. https://doi.org/10.4071/2380-4505-2018.1.000037.

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