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Symposium Proceedings
Vol. 2018, Issue 1, 2018October 01, 2018 EDT

Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost

Henning Hübner, Christian Ohde, Dirk Ruess,
FO-PLPRDLadvanced packaging
https://doi.org/10.4071/2380-4505-2018.1.000037
IMAPSource Conference Papers
Hübner, Henning, Christian Ohde, and Dirk Ruess. 2018. “Upscaling Panel Size for Cu Plating on FOPLP (Fan Out Panel Level Packaging) Applications to Reduce Manufacturing Cost.” IMAPSource Proceedings 2018 (1): 37–42. https:/​/​doi.org/​10.4071/​2380-4505-2018.1.000037.
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