Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost
Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost
Hübner, Henning, Christian Ohde, and Dirk Ruess. 2018. “Upscaling Panel Size for Cu Plating on FOPLP (Fan Out Panel Level Packaging) Applications to Reduce Manufacturing Cost.” IMAPSource Proceedings 2018 (1): 37–42. https://doi.org/10.4071/2380-4505-2018.1.000037.